10AS057K2F35E1HG vs 10AS057K2F35I2SG 对比
详细并排对比 10AS057K2F35E1HG 出自 Intel 和 10AS057K2F35I2SG 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10AS057K2F35E1HG | 10AS057K2F35I2SG |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,995.00 | $3,198.40 |
| Family | Arria 10 SX | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 | 570K |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 29.4 Mbits (M20K + MLAB) | [DATA_NEEDED: M20K / MLAB bit count] |
| DSP Blocks (18x19 Multipliers) | 1,566 | — |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O] | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | — |
| Transceivers | 24 (up to 17.4 Gbps) | [DATA_NEEDED: transceiver count and max data rate] |
| PCIe Hard IP | Gen2/Gen3 x8 | — |
| Memory Interfaces (FPGA side) | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM 3 | — |
| Memory Interfaces (HPS side) | DDR4, DDR3, LPDDR3 | — |
| 封装 | 1152-ball FC-BGA (F35), 35x35 mm | 1152-ball FC-FBGA (F35), 35x35 mm |
| Process Technology | 20 nm TSMC | — |
| Operating Temperature Grade | Industrial | — |
| RoHS 状态 | Compliant | Compliant (lead-free finish) |
| Supply Voltage (Core) | [DATA_NEEDED: Vcore] | — |
| Processor Core | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | — | 1.5 GHz |
| Speed Grade | — | -2 |
| 工作温度 | — | -40C to +100C (Industrial) |
| User I/O Count | — | 396 (per Heisener parametric data) |
| Process Node | — | 20 nm TSMC |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| HPS Peripherals | — | EMAC, USB 2.0 OTG, SPI, I2C, NAND/NOR flash controllers, SD/MMC |
| Memory Interfaces | — | DDR3/DDR4/LPDDR3 hard controllers (Arria 10 HPS) |
| Configuration | — | FPGA + HPS independent / coordinated boot |
| 安装类型 | — | Surface Mount (BGA) |
| MSL 等级 | — | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] |