10AX115H2F34E2SG vs 10AX115U3F45E2SG 对比
详细并排对比 10AX115H2F34E2SG 出自 Intel 和 10AX115U3F45E2SG 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10AX115H2F34E2SG | 10AX115U3F45E2SG |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $5,500.00 | $5,800.00 |
| Series | Arria 10 GX | — |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | 427,200 |
| Embedded Memory (M20K blocks) | 2,713 blocks / 68,857,600 bits | — |
| User I/O Pins | 504 | — |
| Transceivers | 24 channels up to 14.1 Gbps | — |
| PCIe Hard IP | Gen3 x4 / Gen2 x8 | — |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | — |
| DSP Blocks | Hardened IEEE 754 single/double-precision floating-point | Variable-precision, hardened floating-point |
| 18x19 Multipliers | 2,150 | — |
| PLLs | Fractional, up to 24 | — |
| Memory Interfaces | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| 封装 | 1152-ball FCBGA (F34) 35x35 mm | 1932-ball FCBGA (F45, 45×45 mm, 1.0 mm pitch) |
| Speed/Operating Temperature Grade | -2 / 0 C to 100 C (E2 = industrial, enhanced) | — |
| Process Node | 20 nm Tri-Gate (Intel) | 20 nm Tri-Gate (Intel) |
| 安装类型 | Surface Mount (BGA) | — |
| RoHS 状态 | Compliant | — |
| Family | — | Arria 10 GX |
| Embedded Memory Bits | — | 68,857,856 (≈ 52.99 Mbit) |
| Number of Transceivers | — | [DATA_NEEDED: per-die transceiver count, F45 package variant] |
| Maximum Transceiver Data Rate | — | 17.4 Gbps |
| Hard Memory Controllers | — | 2 (DDR4/DDR3/QDRII+/RLDRAM3) |
| Hard PCIe Gen3 IP Blocks | — | 2 × PCIe Gen3 (x8/x4/x2/x1) |
| Speed Grade | — | -2 (E2 commercial/extended) |
| 工作温度 | — | Industrial (junction -40 °C to +100 °C) – device grade U |
| Supply Voltage Core | — | [DATA_NEEDED: VCC/VCCP core voltage] |
| Configuration Method | — | FPGA configuration via serial/parallel flash, JTAG |
| RoHS Compliance | — | Compliant |
| MSL 等级 | — | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] |