10AX115U2F45E1SG vs 10AX115U4F45E3LG 对比
详细并排对比 10AX115U2F45E1SG 出自 Intel 和 10AX115U4F45E3LG 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10AX115U2F45E1SG | 10AX115U4F45E3LG |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $13,900.00 | $5,650.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 68,857,600 | — |
| Embedded Memory (Mbits) | 68.86 Mbit | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 1,518 (variable-precision) |
| 18x18 Multipliers | 1,518 | — |
| User I/O Pins | 480 | — |
| Transceiver Channels | 24 | Up to 96 |
| Max Transceiver Data Rate | 17.4 Gbps (chip-to-chip/backplane) | 17.4 Gbps |
| Hard Memory Controllers | 6 (DDR4/DDR3/QDRII+/RLDRAM3) | Yes (DDR3/DDR4, QDR IV, RLDRAM 3) |
| PCIe Hard IP | PCIe Gen3 x8 | — |
| Process Node | TSMC 20 nm | 20 nm TSMC |
| Core Voltage | 0.9 V | — |
| 封装 | 1932-ball FCBGA, 45 x 45 mm, 1.0 mm pitch | 1932-ball FCBGA |
| Grade | E1 (extended industrial, -40C to +100C) | — |
| RoHS 状态 | Compliant | Compliant |
| Embedded Memory Bits | — | 68,857,856 |
| User I/Os | — | 480 |
| Hard PCIe Gen3 Cores | — | Yes (x8 capable) |
| Speed Grade | — | E3 (fastest commercial) |
| Temperature Grade | — | L (extended commercial) |
| 安装类型 | — | Surface Mount (BGA) |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |