10M04SAU324I7G vs 10M04SCU324C8G 对比

详细并排对比 10M04SAU324I7G 出自 Intel 和 10M04SCU324C8G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
10M04SAU324I7G 10M04SAU324I7G - MAX 10 FPGA, 4K LE, 246 I/O | Intel

10M04SAU324I7G - MAX 10 FPGA, 4K LE, 246 I/O | Intel

10M04SAU324I7G ✓ 量产中

规格对比

参数 10M04SAU324I7G 10M04SCU324C8G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $16.20 $11.45
Family MAX 10 MAX 10
Logic Elements (LE) 4,000 4,000
Maximum User I/Os 246 —
Embedded Memory (bits) 193,536 —
Embedded Memory Blocks M9K, 16 Kbits each —
Number of Memory Blocks [DATA_NEEDED: M9K block count] —
Number of PLLs [DATA_NEEDED: PLL count for 10M04] —
Number of Global Clocks [DATA_NEEDED: global clock network count] —
Number of Analog Inputs (ADC) 4 (single-ended) / up to 8 (differential via soft IP) —
ADC Resolution 12-bit SAR —
ADC Sampling Rate [DATA_NEEDED: MSPS for 10M04 ADC] —
Configuration Memory On-chip dual-configuration flash (non-volatile) Internal dual-configuration flash (non-volatile)
Process Technology TSMC 55nm embedded flash 55 nm CMOS
Core Voltage 1.0 V (10M04S variant) —
工作温度范围 -40C to +100C (Industrial, 'I' grade) —
Speed Grade 7 (I7G speed bin) C8
封装 324-LFBGA (UBGA-324), 15 mm x 15 mm 324-LFBGA (UBGA), 15 mm × 15 mm
安装类型 Surface Mount (BGA) Surface Mount (BGA)
RoHS 状态 Compliant Compliant
MSL 等级 3 —
Design Tool Intel Quartus Prime (Lite / Standard / Pro) —
Embedded Memory (M9K) — 246 Kbits (193,536 RAM bits total)
Embedded Block RAM Blocks — M9K × N
Core Voltage (VCCINT) — 1.2 V (typical)
Maximum User I/O — [DATA_NEEDED: exact count per U324 package]
Temperature Grade — Commercial (0 °C to 85 °C junction)
ADC Blocks — 12-bit successive-approximation (MAX 10 family feature)
DSP Blocks — Yes (18 × 18 multipliers)
User Flash Memory — Yes (MAX 10 family feature)
PLLs — Yes (peripheral and general-purpose)
Lead-Free — Yes

数据手册与资源

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