10M04SAU324I7G vs 10M08SAU324I7G 对比
详细并排对比 10M04SAU324I7G 出自 Intel 和 10M08SAU324I7G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10M04SAU324I7G | 10M08SAU324I7G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $16.20 | $23.40 |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements (LE) | 4,000 | 8000 |
| Maximum User I/Os | 246 | — |
| Embedded Memory (bits) | 193,536 | — |
| Embedded Memory Blocks | M9K, 16 Kbits each | — |
| Number of Memory Blocks | [DATA_NEEDED: M9K block count] | — |
| Number of PLLs | [DATA_NEEDED: PLL count for 10M04] | — |
| Number of Global Clocks | [DATA_NEEDED: global clock network count] | — |
| Number of Analog Inputs (ADC) | 4 (single-ended) / up to 8 (differential via soft IP) | — |
| ADC Resolution | 12-bit SAR | — |
| ADC Sampling Rate | [DATA_NEEDED: MSPS for 10M04 ADC] | — |
| Configuration Memory | On-chip dual-configuration flash (non-volatile) | On-die flash (non-volatile) |
| Process Technology | TSMC 55nm embedded flash | — |
| Core Voltage | 1.0 V (10M04S variant) | — |
| 工作温度范围 | -40C to +100C (Industrial, 'I' grade) | — |
| Speed Grade | 7 (I7G speed bin) | — |
| 封装 | 324-LFBGA (UBGA-324), 15 mm x 15 mm | 324-LFBGA (UBGA-324), 15x15 mm |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| RoHS 状态 | Compliant | Compliant |
| MSL 等级 | 3 | — |
| Design Tool | Intel Quartus Prime (Lite / Standard / Pro) | — |
| Embedded User Flash | — | 387,072 bits |
| General Purpose SRAM | — | 246 Kbits |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: multiplier count] |
| PLLs | — | 2 (with up to 4 output taps) |
| Maximum User I/O Pins | — | 250 |
| On-chip ADC | — | Dual 12-bit, 1 MSPS |
| Core Voltage (VCC) | — | 1.2 V |
| 工作电源电压 | — | 3 V / 3.3 V |
| Configuration Interface | — | JTAG (IEEE 1149.1), Active Serial |
| 工作温度 | — | -40C to +100C (Industrial) |