10M08DAF484C8G vs 10M08DAF484I7G 对比

详细并排对比 10M08DAF484C8G 出自 Intel 和 10M08DAF484I7G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
10M08DAF484C8G 10M08DAF484C8G - MAX 10 FPGA, 8K LEs, 484-FBGA | Intel

10M08DAF484C8G - MAX 10 FPGA, 8K LEs, 484-FBGA | Intel

10M08DAF484C8G ✓ 量产中
Intel
10M08DAF484I7G 10M08DAF484I7G - MAX 10 FPGA, 8K LE, 484-FBGA | Intel

10M08DAF484I7G - MAX 10 FPGA, 8K LE, 484-FBGA | Intel

10M08DAF484I7G ✓ 量产中

规格对比

参数 10M08DAF484C8G 10M08DAF484I7G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $27.65 $25.80
Family MAX 10 MAX 10 FPGA
Logic Elements (LE) 8000 8000
Embedded Memory 387,072 bits (378 Kbits) —
User Flash 1,540 Kbits —
Maximum User I/O 250 —
ADC 8-channel, 12-bit —
PLLs 2 —
Process Technology 55 nm 55 nm
Core Voltage 1.2 V —
I/O Bank Voltage 1.2 V to 3.3 V —
封装 484-ball FBGA (FineLine BGA) —
Speed Grade -C8 —
工作结温 -40 C to +100 C (industrial) —
Configuration Internal flash, dual-configuration, RSU support —
DSP Blocks Yes —
RoHS 状态 Compliant Compliant
Series — MAX 10
Embedded Memory (bits) — 387072
Embedded Memory (Kb) — 378
Number of I/Os — 250
Number of LABs/CLBs — [DATA_NEEDED: number of LABs]
Number of Logic Array Blocks — [DATA_NEEDED: LAB count]
工作温度 — -40 °C to +100 °C (Industrial)
Supply Voltage - Core — 1.2 V
安装类型 — Surface Mount
封装 / 外壳 — 484-BGA
Supplier Device Package — 484-FBGA (23x23 mm)
Lead Free — Yes
Configuration Memory — Internal flash (non-volatile)

数据手册与资源

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