10M25DAF484I7G vs 10M08DAF484I7G 对比

详细并排对比 10M25DAF484I7G 出自 Intel 和 10M08DAF484I7G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
10M25DAF484I7G 10M25DAF484I7G - MAX 10 FPGA 25K LE 484-FBGA | Intel

10M25DAF484I7G - MAX 10 FPGA 25K LE 484-FBGA | Intel

10M25DAF484I7G ✓ 量产中
Intel
10M08DAF484I7G 10M08DAF484I7G - MAX 10 FPGA, 8K LE, 484-FBGA | Intel

10M08DAF484I7G - MAX 10 FPGA, 8K LE, 484-FBGA | Intel

10M08DAF484I7G ✓ 量产中

规格对比

参数 10M25DAF484I7G 10M08DAF484I7G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $99.80 $25.80
Family MAX 10 MAX 10 FPGA
Logic Elements (LE) 25,000 8000
Embedded Memory (bits) 691,200 387072
User I/Os 360 —
封装 484-FBGA (FBGA) —
Core Voltage 1.2 V —
Speed Grade I7 —
Temperature Grade Industrial (-40 C to +100 C ambient) —
安装类型 Surface Mount (BGA) Surface Mount
Tray / Reel Tray —
18 x 18 Multipliers 66 —
PLLs 2 —
On-chip Configuration Flash Dual (instant-on, dual-boot) —
Integrated ADC 12-bit SAR, up to 17 analog inputs —
RoHS 状态 Compliant Compliant
Series — MAX 10
Embedded Memory (Kb) — 378
Number of I/Os — 250
Number of LABs/CLBs — [DATA_NEEDED: number of LABs]
Number of Logic Array Blocks — [DATA_NEEDED: LAB count]
工作温度 — -40 °C to +100 °C (Industrial)
Supply Voltage - Core — 1.2 V
封装 / 外壳 — 484-BGA
Supplier Device Package — 484-FBGA (23x23 mm)
Process Technology — 55 nm
Lead Free — Yes
Configuration Memory — Internal flash (non-volatile)

数据手册与资源

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