10M25DAF484I7G vs 10M25DCF484I7G 对比

详细并排对比 10M25DAF484I7G 出自 Intel 和 10M25DCF484I7G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
10M25DAF484I7G 10M25DAF484I7G - MAX 10 FPGA 25K LE 484-FBGA | Intel

10M25DAF484I7G - MAX 10 FPGA 25K LE 484-FBGA | Intel

10M25DAF484I7G ✓ 量产中
Intel
10M25DCF484I7G 10M25DCF484I7G - MAX 10 FPGA 25K LE 484-BGA | Intel

10M25DCF484I7G - MAX 10 FPGA 25K LE 484-BGA | Intel

10M25DCF484I7G ✓ 量产中

规格对比

参数 10M25DAF484I7G 10M25DCF484I7G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $99.80 $45.10
Family MAX 10 MAX 10
Logic Elements (LE) 25,000 —
Embedded Memory (bits) 691,200 —
User I/Os 360 —
封装 484-FBGA (FBGA) 484-ball FineLine BGA (F484)
Core Voltage 1.2 V —
Speed Grade I7 —
Temperature Grade Industrial (-40 C to +100 C ambient) Industrial (-40C to +100C), I7 suffix
安装类型 Surface Mount (BGA) Surface Mount (BGA)
Tray / Reel Tray —
18 x 18 Multipliers 66 —
PLLs 2 Up to 4
On-chip Configuration Flash Dual (instant-on, dual-boot) —
Integrated ADC 12-bit SAR, up to 17 analog inputs —
RoHS 状态 Compliant Compliant
Logic Elements — 25,000
Embedded Memory — 1,728 Kbits (M9K blocks)
User I/O Pins — 360
Ball Pitch — 1.0 mm
电源电压 — 1.2 V core
Configuration Memory — 5 Mb on-chip flash
Process Technology — 55 nm TSMC
Multiplier Blocks — [DATA_NEEDED: 18x18 multiplier count]
工作温度 — -40C to +100C

数据手册与资源

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