10M50DAF256C8G vs 10M50DCF256C8G 对比
详细并排对比 10M50DAF256C8G 出自 Intel 和 10M50DCF256C8G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10M50DAF256C8G | 10M50DCF256C8G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $47.85 | $52.85 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 49,760 (50K) | — |
| Embedded Memory (bits) | 1,677,312 | — |
| User Flash (bits) | 1,677,312 | — |
| Maximum User I/Os | 178 | — |
| Multipliers (18x18) | 312 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| On-chip ADC | 12-bit, 1 MSPS, single or dual supply | — |
| Process Technology | 55 nm | TSMC 55 nm embedded flash CMOS |
| Core Voltage | 1.2 V | 1.0 V (internal) |
| Configuration | Internal flash (non-volatile, instant-on) | — |
| Speed Grade | C8 (8 ns) | 8 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (C suffix) |
| 封装 | 256-ball FBGA (F256) | 256-pin FBGA (FBGA256), 17x17 mm |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| RoHS 状态 | Compliant | Compliant |
| MSL 等级 | 3 (per JEDEC J-STD-20) | — |
| Logic Elements (LE) | — | 50,000 |
| Embedded Memory | — | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) |
| User Flash Memory | — | 1,677,312 bits |
| DSP Blocks (18x18 Multipliers) | — | 172 |
| Maximum User I/O Pins | — | 178 |
| Hard ADC Blocks | — | 2 (12-bit, 1 MSPS) |
| I/O Bank Voltage | — | 2.5 V / 3.3 V (LVCMOS compatible) |
| Configuration Method | — | On-die non-volatile flash (instant-on); dual-boot supported |