A3PE3000-2FG324I vs A3PE3000-FGG324I 对比

详细并排对比 A3PE3000-2FG324I 出自 Microchip Technology 和 A3PE3000-FGG324I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
A3PE3000-2FG324I A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

A3PE3000-2FG324I ✓ 量产中
Microchip Technology
A3PE3000-FGG324I A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-FGG324I ✓ 量产中

规格对比

参数 A3PE3000-2FG324I A3PE3000-FGG324I
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $0.00 $198.00
Manufacturer Microchip Technology (Microsemi) —
Family ProASIC3E ProASIC3E (ProASIC3E Flash Family)
Logic Elements (LEs) 35000 LEs —
System Gates 3M gates 3000000 gates
Maximum System Performance 310 MHz —
Process Technology 130 nm flash —
Core Supply Voltage 1.5 V 1.5 V
Number of I/Os 221 I/O —
封装 / 外壳 324-Ball FBGA —
安装方式 SMD/SMT —
Operating Temperature (Min) -40 C —
Operating Temperature (Max) +85 C —
Speed Grade -2 —
Temperature Grade Industrial (I) —
Configuration Memory Non-volatile Flash (single chip) Nonvolatile flash, reprogrammable, Instant-On
Packaging Tray —
Product Series A3PE3000 —
Logic Elements (CLBs) — 75264
Total User I/O — 221
Embedded Memory — 516096 bits
Maximum Frequency — 350 MHz
Technology — 130 nm CMOS, nonvolatile flash
封装 — 324-BGA (FBGA/PBGA324), 19 x 19 mm
Ball Pitch — 1 mm
Package Height — 1.63 mm
工作温度 — -40 C to +125 C (Industrial, I grade)
安装类型 — Surface Mount
Moisture Sensitivity Level — [DATA_NEEDED: MSL Level]
RoHS 状态 — [DATA_NEEDED: RoHS status]

数据手册与资源

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