A3PE3000-2FGG324 vs A3PE3000-1FGG324I 对比
详细并排对比 A3PE3000-2FGG324 出自 Microchip Technology 和 A3PE3000-1FGG324I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-2FGG324 ✓ 量产中Microchip Technology
A3PE3000-1FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-1FGG324I ✓ 量产中规格对比
| 参数 | A3PE3000-2FGG324 | A3PE3000-1FGG324I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $216.00 | $0.00 |
| Family | ProASIC3E | ProASIC3E (Flash-based FPGA) |
| System Gates | 3000000 | 3,000,000 |
| Logic Cells | 75264 | — |
| CLBs | 75264 | — |
| Maximum System Frequency | 310 MHz | — |
| Process Technology | 130 nm CMOS flash | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.5 V | — |
| Configuration Memory | Flash (single-chip, instant-on) | — |
| User I/O | 221 | — |
| Total Memory Bits | [DATA_NEEDED: embedded SRAM capacity] | — |
| 封装 | 324-ball FBGA (FGG324) | 324-BGA FBGA (19x19 mm, 1 mm pitch) |
| Package Dimensions | 19 x 19 mm, 1 mm pitch, 1.63 mm height | — |
| 安装类型 | Surface Mount | Surface Mount |
| Speed Grade | 2 | -1 |
| 工作温度 | [DATA_NEEDED: operating temperature range] | -40C to +100C (TJ) |
| Packaging Type | Tray | — |
| RoHS 状态 | Green (RoHS compliant) | ROHS3 Compliant |
| Automotive Qualification | Not qualified (standard grade) | — |
| User I/Os (this package) | — | 221 |
| Max User I/Os (family) | — | 616 |
| Embedded SRAM | — | 504 kbits true dual-port |
| Supply Voltage (core) | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Configuration | — | Flash-based, Live-at-Power-Up Level 0, single-chip |
| Soft CPU Support | — | Optional soft ARM support |
| Number of Gates | — | 3,000,000 |
| Packaging | — | Tray |
| Product Status | — | Active |
| Manufacturer Lead Time | — | 8 weeks |