A3PE3000-2FGG324 vs A3PE3000-2FG324I 对比

详细并排对比 A3PE3000-2FGG324 出自 Microchip Technology 和 A3PE3000-2FG324I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
A3PE3000-2FGG324 A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-2FGG324 ✓ 量产中
Microchip Technology
A3PE3000-2FG324I A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

A3PE3000-2FG324I ✓ 量产中

规格对比

参数 A3PE3000-2FGG324 A3PE3000-2FG324I
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $216.00 $0.00
Family ProASIC3E ProASIC3E
System Gates 3000000 3M gates
Logic Cells 75264 —
CLBs 75264 —
Maximum System Frequency 310 MHz —
Process Technology 130 nm CMOS flash 130 nm flash
Core Supply Voltage 1.5 V 1.5 V
Configuration Memory Flash (single-chip, instant-on) Non-volatile Flash (single chip)
User I/O 221 —
Total Memory Bits [DATA_NEEDED: embedded SRAM capacity] —
封装 324-ball FBGA (FGG324) —
Package Dimensions 19 x 19 mm, 1 mm pitch, 1.63 mm height —
安装类型 Surface Mount —
Speed Grade 2 -2
工作温度 [DATA_NEEDED: operating temperature range] —
Packaging Type Tray —
RoHS 状态 Green (RoHS compliant) —
Automotive Qualification Not qualified (standard grade) —
Manufacturer — Microchip Technology (Microsemi)
Logic Elements (LEs) — 35000 LEs
Maximum System Performance — 310 MHz
Number of I/Os — 221 I/O
封装 / 外壳 — 324-Ball FBGA
安装方式 — SMD/SMT
Operating Temperature (Min) — -40 C
Operating Temperature (Max) — +85 C
Temperature Grade — Industrial (I)
Packaging — Tray
Product Series — A3PE3000

数据手册与资源

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