A3PE3000L-1FG484M vs A3PE3000L-1FG484I 对比
详细并排对比 A3PE3000L-1FG484M 出自 Microchip Technology 和 A3PE3000L-1FG484I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
A3PE3000L-1FG484M - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FG484M ✓ 量产中Microchip Technology
A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip
A3PE3000L-1FG484I ✓ 量产中规格对比
| 参数 | A3PE3000L-1FG484M | A3PE3000L-1FG484I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $89.90 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 | 3,000,000 gates |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Number of I/O | 341 | 341 |
| Maximum Frequency | 250 MHz | — |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V (family supports 1.2 V to 1.5 V) |
| Technology | 130 nm flash process | — |
| Configuration Memory | On-chip Flash (instant-on, reprogrammable) | — |
| Low Power Feature | Flash*Freeze technology | — |
| 封装 | 484-ball FBGA (FG484) | 484-ball FBGA (FG484) |
| 安装类型 | Surface Mount | Surface Mount |
| Speed Grade | -1 (standard) | -1 |
| Temperature Grade / Operating Temp | M (per ordering code); [DATA_NEEDED: exact operating temperature range] | — |
| JTAG Boundary Scan | IEEE 1149.1 supported | — |
| Input Options | Schmitt trigger option on single-ended inputs (A3PE3000L) | — |
| Pull Options | Weak pull-up / pull-down | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements (LEs) | — | 35 KLEs |
| Total RAM Bits | — | 516096 bits |
| Process Technology | — | 130 nm flash |
| Special Features | — | Flash*Freeze technology, non-volatile single-chip |
| Terminal Form | — | Ball (BGA, square) |
| Temperature Grade | — | Industrial (I) |
| 工作温度 | — | [DATA_NEEDED: exact min/max operating temperature range] |
| Supply Voltage - I/O | — | [DATA_NEEDED: I/O bank voltage range] |
| Configuration | — | On-chip flash, no external boot device |
| Packaging | — | Tray |