A3PE3000L-FGG324 vs A3PE3000-2FG324I 对比

详细并排对比 A3PE3000L-FGG324 出自 Microchip Technology 和 A3PE3000-2FG324I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
A3PE3000L-FGG324 A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip

A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip

A3PE3000L-FGG324 ✓ 量产中
Microchip Technology
A3PE3000-2FG324I A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

A3PE3000-2FG324I ✓ 量产中

规格对比

参数 A3PE3000L-FGG324 A3PE3000-2FG324I
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $86.15 $0.00
Manufacturer Part Number A3PE3000L-FGG324 —
Family ProASIC3L (Flash-based FPGA) ProASIC3E
System Gates 3,000,000 3M gates
Logic Cells (CLBs) 75264 —
User I/O 221 —
Configuration Memory On-chip Flash (single-chip, nonvolatile) Non-volatile Flash (single chip)
Core Voltage Range 1.2 V to 1.5 V —
工作电源电压 1.5 V —
Maximum Operating Frequency 250 MHz —
Special Features Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down —
Boundary Scan IEEE 1149.1 (JTAG) —
封装 324-BGA / FBGA (FGG324) —
安装方式 SMD/SMT SMD/SMT
工作温度 0 C to +70 C (commercial) —
Packaging Tray Tray
Embedded RAM [DATA_NEEDED: embedded RAM capacity] —
RoHS 状态 [DATA_NEEDED: RoHS status] —
Manufacturer — Microchip Technology (Microsemi)
Logic Elements (LEs) — 35000 LEs
Maximum System Performance — 310 MHz
Process Technology — 130 nm flash
Core Supply Voltage — 1.5 V
Number of I/Os — 221 I/O
封装 / 外壳 — 324-Ball FBGA
Operating Temperature (Min) — -40 C
Operating Temperature (Max) — +85 C
Speed Grade — -2
Temperature Grade — Industrial (I)
Product Series — A3PE3000

数据手册与资源

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