A3PE3000L-FGG324 vs A3PE3000L-1FGG324I 对比
详细并排对比 A3PE3000L-FGG324 出自 Microchip Technology 和 A3PE3000L-1FGG324I 出自 Microsemi。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
A3PE3000L-FGG324 ✓ 量产中规格对比
| 参数 | A3PE3000L-FGG324 | A3PE3000L-1FGG324I |
|---|---|---|
| 品牌 | Microchip Technology | Microsemi |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $86.15 | $0.00 |
| Manufacturer Part Number | A3PE3000L-FGG324 | — |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3L |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells (CLBs) | 75264 | — |
| User I/O | 221 | 221 |
| Configuration Memory | On-chip Flash (single-chip, nonvolatile) | — |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| 工作电源电压 | 1.5 V | — |
| Maximum Operating Frequency | 250 MHz | — |
| Special Features | Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| 封装 | 324-BGA / FBGA (FGG324) | 324-ball FBGA (FGG), 19 x 19 mm |
| 安装方式 | SMD/SMT | — |
| 工作温度 | 0 C to +70 C (commercial) | -40C to +125C (Industrial, I suffix) |
| Packaging | Tray | — |
| Embedded RAM | [DATA_NEEDED: embedded RAM capacity] | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| Logic Elements (Cells) | — | 75264 |
| Embedded RAM Bits | — | 516096 |
| Core Voltage | — | 1.2 V (1.2 V to 1.5 V range) |
| Process Technology | — | 130 nm flash |
| Speed Grade | — | -1 |
| 安装类型 | — | Surface Mount |
| Programming Technology | — | Nonvolatile Flash (Instant On, single chip) |
| Low Power Feature | — | Flash*Freeze Technology |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL Level] |
| Number of Logic Blocks (CLBs) | — | 75264 |