A3PE3000L-FGG896M vs A3PE3000-FGG896I 对比
详细并排对比 A3PE3000L-FGG896M 出自 Microchip Technology 和 A3PE3000-FGG896I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
A3PE3000L-FGG896M - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-FGG896M ✓ 量产中规格对比
| 参数 | A3PE3000L-FGG896M | A3PE3000-FGG896I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $135.20 |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3E |
| System Gates | 3,000,000 | — |
| Logic Cells | 75,264 | — |
| User I/Os | Up to 616 (620 per DigiKey listing) | — |
| Embedded SRAM | 504 kbits true dual-port | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm flash |
| Core Voltage | 1.2 V to 1.5 V | — |
| 电源电压 | 1.5 V | — |
| 封装 | 896-ball FBGA (FGG896), 1 mm pitch | — |
| Logic Family | CMOS | — |
| 工作温度 | 0 to 70 C | — |
| 安装类型 | Surface Mount | — |
| Configuration | Non-volatile flash, live-at-power-up Level 0, single-chip | — |
| Low-Power Feature | Flash*Freeze technology | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Input Features | Schmitt trigger option on single-ended inputs; weak pull-up/pull-down | — |
| Logic Elements (LEs) | — | 35,000 LEs |
| Number of I/Os | — | 620 I/O |
| Operating Supply Voltage (Core) | — | 1.5 V |
| System Performance | — | 231 MHz |
| 封装 / 外壳 | — | 896-BGA (FBGA, FGG896) |
| 安装方式 | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Temperature Grade | — | Industrial (I) |
| Packaging | — | Tray |
| Configuration Memory | — | On-chip Flash (nonvolatile, Instant-On) |
| Terminal Form | — | Ball |
| Terminal Count | — | 896 |
| Product Series | — | A3PE3000 |
| RoHS 状态 | — | [DATA_NEEDED: RoHS Status] |
| Total On-Chip Configuration Bits | — | 516096 (per DigiKey listing) |