A3PE600-1FGG256 vs A3PE600-1FGG256I 对比
详细并排对比 A3PE600-1FGG256 出自 Microchip Technology 和 A3PE600-1FGG256I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
A3PE600-1FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
A3PE600-1FGG256 ✓ 量产中Microchip Technology
A3PE600-1FGG256I - 600K-Gate Flash FPGA 165 I/O | Microchip
A3PE600-1FGG256I ✓ 量产中规格对比
| 参数 | A3PE600-1FGG256 | A3PE600-1FGG256I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $38.90 | $33.50 |
| Family | ProASIC3E | ProASIC3E |
| System Gates | 600000 | 600000 |
| Logic Elements | 7K LEs | — |
| User I/O | 165 | 165 |
| Registers | 110592 | — |
| Core Supply Voltage | 1.5 V | 1.425 V to 1.575 V (1.5 V nominal) |
| Maximum System Frequency | 272 MHz | — |
| Process Technology | 130-nm, 7-layer metal (6 copper) flash-based CMOS | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration Memory | On-chip flash (single-chip, live-at-power-up) | On-chip Flash (Live at Power-Up, Level 0) |
| Speed Grade | -1 | -1 |
| 工作温度 | 0 C to +70 C | -40C to +100C (TJ), industrial |
| 封装 | 256-LBGA (FBGA-256, 1 mm ball pitch) | 256-LBGA (FBGA-256), 1.0 mm ball pitch |
| 安装类型 | Surface Mount | Surface Mount |
| Logic Family | CMOS | CMOS |
| Embedded Memory (family max) | Up to 504 kbits True Dual-Port SRAM | — |
| Power-Up Support | Live-At-Power-Up Level 0 | — |
| Reprogrammability | Yes (flash-based, in-system reprogrammable) | Yes (single-chip, no external boot PROM) |
| Logic Cells | — | 13824 |
| Embedded SRAM | — | 110592 bits (up to 504 kbits family density) |
| Maximum System Performance | — | 272 MHz |
| Typical Application Domains | — | Industrial, communications, medical, aerospace/defense |
| RoHS 状态 | — | [DATA_NEEDED: RoHS compliance status] |