AFS600-1FGG256 vs M7AFS600-FGG256I 对比

详细并排对比 AFS600-1FGG256 出自 Microchip Technology 和 M7AFS600-FGG256I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
AFS600-1FGG256 AFS600-1FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-1FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-1FGG256 ✓ 量产中
Microchip Technology
M7AFS600-FGG256I M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I ✓ 量产中

规格对比

参数 AFS600-1FGG256 M7AFS600-FGG256I
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
System Gates 600,000 gates 600K
User I/O 119 I/O 119
电源电压 1.5 V —
Logic Family Flash-based CMOS —
Process Technology 130 nm CMOS 130 nm
Metal Layers 7 layers —
Package Type 256-ball FBGA —
Package Pin Count 256 balls —
Package Pitch 1.0 mm —
工作温度 0°C to 70°C —
Configuration Memory Embedded nonvolatile flash —
Power-Up Configuration Live at power-up —
Integrated Analog Resources Configurable analog blocks —
Integrated Clock Management Clock generation and management —
Embedded Memory Large flash memory blocks —
Package Family FBGA surface-mount package family —
RoHS 状态 RoHS compliant —
Lead-Free Status Lead-free —
Pin Assignments [DATA_NEEDED: complete AFS600-1FGG256 pin assignments] —
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] —
Family — Fusion Mixed-Signal FPGA
封装 — 256-LBGA (FBGA), 1 mm ball pitch
Core Voltage — 1.5 V
Maximum System Frequency — 1098.9 MHz (per distributor parametric listing)
Embedded Processor — ARM CoreMP7
Fabric Type — Flash-based, non-volatile, instant-on
Analog Subsystem — Integrated configurable analog (per Microchip Fusion family page)
On-chip Flash Memory — Yes (large flash memory blocks, per Microchip Fusion family page)
Clock Management — Integrated clock generation and management circuitry (PLLs)
Temperature Grade — Industrial (I suffix)
工作温度范围 — -40C to +85C (industrial grade standard range)
安装类型 — Surface Mount
Packaging — Tray
MSL 等级 — [DATA_NEEDED: MSL Level]
Thermal Resistance (theta_JA) — [DATA_NEEDED: Thermal Resistance]

数据手册与资源

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