AFS600-2FG256I vs M7AFS600-FG256I 对比

详细并排对比 AFS600-2FG256I 出自 Microchip Technology 和 M7AFS600-FG256I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
AFS600-2FG256I AFS600-2FG256I - 600K Mixed-Signal Fusion FPGA | Microchip

AFS600-2FG256I - 600K Mixed-Signal Fusion FPGA | Microchip

AFS600-2FG256I ✓ 量产中
Microchip Technology
M7AFS600-FG256I M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I ✓ 量产中

规格对比

参数 AFS600-2FG256I M7AFS600-FG256I
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Device Type Fusion mixed-signal field-programmable gate array (FPGA) —
System Gates 600,000 gates 600K
User I/O 119 I/O —
封装 256-LBGA —
Total Terminals 256 terminals —
Package Pitch 1.0 mm —
电源电压 1.5 V —
Maximum System Performance Frequency 350 MHz —
Process Technology 130 nm CMOS 130 nm
Metal Layers 7 layers —
Configuration Memory Technology Nonvolatile flash —
Power-Off Configuration Retention Retains program when powered off —
Power-Up Behavior Live at Power-Up (LAPU) —
Programmable Analog Configurable analog blocks —
Embedded Memory Large flash memory blocks —
Clock Management Comprehensive clock generation and management circuitry —
Temperature Grade Industrial —
RoHS 状态 Non-Compliant —
Lead-Free Status Contains lead —
Series — M7AFS600 (Fusion)
Logic Capacity (DigiKey listing) — 110592
Number of I/O — 119 I/O
Embedded Processor — ARM CoreMP7
Core Supply Voltage — 1.5 V
封装 / 外壳 — 256-LBGA (FBGA)
Terminal Form — Ball
Package Shape — Square
安装方式 — SMD/SMT
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Packaging — Tray
Programmable Logic Type — Flash-based, non-volatile
Analog Integration — Mixed-signal (configurable analog + flash memory)

数据手册与资源

浏览全部产品 创建 BOM 获取报价