AFS600-2FGG256 vs M7AFS600-FGG256 对比

详细并排对比 AFS600-2FGG256 出自 Microchip Technology 和 M7AFS600-FGG256 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
AFS600-2FGG256 AFS600-2FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-2FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-2FGG256 ✓ 量产中
Microchip Technology
M7AFS600-FGG256 M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip

M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip

M7AFS600-FGG256 ✓ 量产中

规格对比

参数 AFS600-2FGG256 M7AFS600-FGG256
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Product Type Fusion mixed-signal FPGA —
System Gates Approximately 600,000 gates 600K
Configurable Logic Blocks 13,824 CLBs —
Reported Logic Elements 7,000 LE —
Number of I/O 119 I/O —
封装 256-LBGA 256-LBGA / 256-FBGA
Package Pin Count 256 balls —
Package Pitch 1.0 mm —
工作电源电压 1.5 V —
工作温度 0°C to +70°C [DATA_NEEDED: Operating Temperature Range]
Process Technology 130 nm CMOS 130 nm flash-based
Metal Layers 7 layers —
Configuration Memory Nonvolatile flash Flash (single-chip, non-volatile)
Power-Up Feature Live at Power-Up —
Maximum DDR Data Rate 700 Mbps —
I/O Features Hot-swappable I/O, programmable slew rate, programmable drive strength, weak pull-up/pull-down —
安装类型 SMD/SMT Surface Mount
Packaging Tray Tray
RoHS 状态 RoHS compliant [DATA_NEEDED: RoHS Status]
Lead-Free Status Lead free —
Family — Fusion (M7AFS600)
Flip-Flops — 110592
User I/O — 119
Embedded Processor — ARM CoreMP7
Core Supply Voltage — 1.5 V
Maximum Frequency — 1098.9 MHz (distributor listing)
Ball Pitch — 1 mm
Analog Features — Integrated configurable analog blocks, clock generation and management
MSL 等级 — [DATA_NEEDED: Moisture Sensitivity Level]

数据手册与资源

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