ATSAM4SA16CB-AN vs ATSAM4S8CB-CFN 对比
详细并排对比 ATSAM4SA16CB-AN 出自 Microchip Technology 和 ATSAM4S8CB-CFN 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
ATSAM4SA16CB-AN - 120MHz Cortex-M4 MCU, 1MB Flash, 100-LQFP
ATSAM4SA16CB-AN ✓ 量产中Microchip Technology
ATSAM4S8CB-CFN - 120MHz Cortex-M4 MCU, 512KB Flash, 100-VFBGA | Microchip
ATSAM4S8CB-CFN ✓ 量产中规格对比
| 参数 | ATSAM4SA16CB-AN | ATSAM4S8CB-CFN |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $5.95 | $4.74 |
| Core Architecture | ARM Cortex-M4 | ARM 32-bit RISC |
| Core Bit Width | 32-bit | — |
| Maximum Clock Speed | 120 MHz | — |
| FPU | Yes (single-precision) | — |
| DSP Instructions | Yes | — |
| Program Memory (Flash) | 1 MB (1M x 8) | 512 KB (512K x 8) |
| SRAM | 152 KB | 128 KB |
| Supply Voltage (VDD) | 1.62 V to 3.6 V | — |
| 工作温度 | -40 C to +85 C (industrial) | — |
| 封装 | 100-LQFP (14x14 mm), green | 100-ball VFBGA, 7x7 mm, 0.65 mm pitch |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| USB | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device with on-chip transceiver |
| CAN | Yes (CAN 2.0A/B) | 2x CAN 2.0A/B controllers |
| Ethernet | EMAC (10/100) | — |
| ADC | 12-bit, multi-channel | 12-bit, up to 16 channels, 1 Msps |
| 引脚数量 | 100 | — |
| RoHS 状态 | Compliant | Compliant |
| Core | — | ARM Cortex-M4 with FPU |
| 最大时钟频率 | — | 120 MHz |
| Supply Voltage Range | — | 1.62 V to 3.6 V |
| Operating Temperature (Industrial) | — | -40C to +85C |
| Operating Temperature (Green, MRL B) | — | -40C to +105C |
| DAC | — | 2x 12-bit DAC |
| Timers | — | Multiple 16-bit and 32-bit timers, PWM, RTC |
| Communication Interfaces | — | UART/USART, SPI, TWI (I2C), I2S, USB, CAN |
| External Bus Interface | — | 16-bit Static Memory Controller (EBI) |
| Supply Current (Active, 100 MHz) | — | approximately 30 mA |
| Supply Current (Backup, RTC) | — | approximately 3 uA at 1.8 V |
| MSL (Moisture Sensitivity) | — | MSL3 (per BGA package) |