ATSAMA5D225C-D1M-CU vs ATSAMA5D22B-CNR 对比
详细并排对比 ATSAMA5D225C-D1M-CU 出自 Microchip Technology 和 ATSAMA5D22B-CNR 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
ATSAMA5D225C-D1M-CU - 500MHz Cortex-A5 MPU w/ 128Mb DDR2 SiP | Microchip
ATSAMA5D225C-D1M-CU ✓ 量产中Microchip Technology
ATSAMA5D22B-CNR - 500MHz Cortex-A5 MPU 196-TFBGA | Microchip
ATSAMA5D22B-CNR ✓ 量产中规格对比
| 参数 | ATSAMA5D225C-D1M-CU | ATSAMA5D22B-CNR |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $12.60 | $7.21 |
| Core Processor | ARM Cortex-A5 | — |
| Number of Cores | 1 Core, 32-Bit | — |
| Maximum CPU Clock | 500 MHz | — |
| Integrated DRAM | 128 Mbit DDR2 SDRAM (SiP) | — |
| ROM / Boot Code | 160 KB ROM | — |
| Graphics Acceleration | Yes (LCD controller up to WXGA 1366x768) | — |
| RAM Controllers | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | — |
| Ethernet | 10/100/1000 GMAC | — |
| USB | 1x HSIC, 1x USB 2.0 HS Host/Device | — |
| CAN | CAN-FD | — |
| Security | Arm TrustZone, secure boot, tamper detection, AES/SHA/TRNG | — |
| Touch Controller | Peripheral Touch Controller (PTC) integrated | — |
| Audio | Embedded audio subsystem (I2S, Class-D amplifier) | — |
| 封装 | 196-ball TFBGA 11x11 mm, 0.8 mm pitch | 196-TFBGA (11x11x1.2 mm) |
| 工作温度 | -40C to +85C (Industrial, IND TEMP) | -40C to +105C (extended) |
| 电源电压 | 1.2 V core (per typical SiP) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| RoHS 状态 | Compliant (Green, lead-free) | Compliant |
| Architecture | — | ARM Cortex-A5 (ARMv7-A) |
| Core Count | — | 1 |
| Data Width | — | 32-bit |
| 最大时钟频率 | — | 500 MHz |
| Core Supply Voltage | — | 1.2 V |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| L2 Cache | — | 128 KB (configurable as SRAM) |
| NEON Media Processing Engine | — | Yes |
| Floating Point Unit | — | Yes |
| ARM TrustZone | — | Yes |
| Peripheral Touch Controller (PTC) | — | Yes |
| Embedded Audio Subsystem | — | Yes (I2S/TDM) |
| Ball Pitch | — | 0.8 mm |
| Packaging | — | Tape & Reel (T&R) |