ATSAMA5D22A-CU vs ATSAMA5D225C-D1M-CU 对比
详细并排对比 ATSAMA5D22A-CU 出自 Microchip Technology 和 ATSAMA5D225C-D1M-CU 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
ATSAMA5D22A-CU - 500MHz Cortex-A5 MPU, 196-TFBGA | Microchip
ATSAMA5D22A-CU ✓ 量产中Microchip Technology
ATSAMA5D225C-D1M-CU - 500MHz Cortex-A5 MPU w/ 128Mb DDR2 SiP | Microchip
ATSAMA5D225C-D1M-CU ✓ 量产中规格对比
| 参数 | ATSAMA5D22A-CU | ATSAMA5D225C-D1M-CU |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $8.20 | $12.60 |
| Series | SAMA5D2 | — |
| Core | ARM Cortex-A5 (32-bit, single-core) | — |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| NEON SIMD Engine | Yes | — |
| Floating Point Unit | Yes | — |
| On-chip SRAM | 128 KB | — |
| Graphics Acceleration | Yes (2D hardware) | Yes (LCD controller up to WXGA 1366x768) |
| External Memory Support | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | — |
| Ethernet | 10/100 Mbps (1 port) | 10/100/1000 GMAC |
| USB | USB 2.0 + HSIC | 1x HSIC, 1x USB 2.0 HS Host/Device |
| Display Controller | LCD controller supporting up to WXGA | — |
| Touch Controller | Peripheral Touch Controller (PTC) integrated | Peripheral Touch Controller (PTC) integrated |
| Audio Subsystem | Embedded (I2S, SSC, Class-D support) | — |
| Cryptography | AES, SHA, TRNG accelerators | — |
| 封装 | 196-TFBGA (11x11 mm, 0.8 mm pitch) | 196-ball TFBGA 11x11 mm, 0.8 mm pitch |
| I/O Voltage | 3.3 V | — |
| Core Voltage | 1.2 V / 1.8 V / 3.3 V | — |
| Backup Mode Current | 5 uA (typical, per datasheet) | — |
| 工作温度 | -40C to +85C (industrial) | -40C to +85C (Industrial, IND TEMP) |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS 状态 | Compliant | Compliant (Green, lead-free) |
| Core Processor | — | ARM Cortex-A5 |
| Number of Cores | — | 1 Core, 32-Bit |
| Integrated DRAM | — | 128 Mbit DDR2 SDRAM (SiP) |
| ROM / Boot Code | — | 160 KB ROM |
| RAM Controllers | — | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI |
| CAN | — | CAN-FD |
| Security | — | Arm TrustZone, secure boot, tamper detection, AES/SHA/TRNG |
| Audio | — | Embedded audio subsystem (I2S, Class-D amplifier) |
| 电源电压 | — | 1.2 V core (per typical SiP) |