ATSAMA5D22B-CU vs ATSAMA5D22B-CUR 对比
详细并排对比 ATSAMA5D22B-CU 出自 Microchip Technology 和 ATSAMA5D22B-CUR 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
ATSAMA5D22B-CU - 500MHz ARM Cortex-A5 MPU, 196-TFBGA | Microchip
ATSAMA5D22B-CU ✓ 量产中Microchip Technology
ATSAMA5D22B-CUR - ARM Cortex-A5 500MHz MPU, 196-TFBGA | Microchip
ATSAMA5D22B-CUR ✓ 量产中规格对比
| 参数 | ATSAMA5D22B-CU | ATSAMA5D22B-CUR |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $10.75 | $9.10 |
| Core Processor | ARM Cortex-A5 (32-bit, single core) | — |
| Core Architecture | ARMv7-A with TrustZone and NEON | ARM Cortex-A5 (32-bit, single-core) |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| L1 Instruction Cache | 32 Kbytes | 128 Kbyte |
| L1 Data Cache | 32 Kbytes | 128 Kbyte |
| L2 Cache / SRAM | 128 Kbytes (configurable as internal SRAM) | — |
| Memory Architecture | MMU (full virtual memory support) | — |
| External Memory Support | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L (16-bit) | — |
| Flash Interfaces | 2x QSPI, e.MMC | — |
| 封装 | 196-TFBGA (CSBGA), 11x11 mm, 0.8 mm pitch | 196-TFBGA, 11x11 mm, 0.75 mm pitch |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | -40 C to +85 C (industrial) | — |
| Supply Voltage (core) | 1.2 V (typ, internal regulator) | — |
| Supply Voltage (I/O) | 3.3 V (typ) | — |
| RoHS 状态 | Compliant | Compliant |
| MSL 等级 | [DATA_NEEDED: MSL level] | 3 (per JEDEC J-STD-020) |
| Lead-Free / Halogen-Free | Lead-free finish; halogen status [DATA_NEEDED] | — |
| L2 Cache | — | 32 Kbyte |
| NEON Media Engine | — | Yes (NEON MPE) |
| Floating Point Unit | — | VFPv4-D32 (single and double precision) |
| External Memory Controller | — | 16-bit DDR2/LPDDR/LPDDR2/DDR3(L) |
| Display Controller | — | 24-bit LCD with overlays, 2D graphics accelerator |
| Video Decoder | — | H.264 / MPEG-4 / VP8 / JPEG hardware decode |
| Ethernet | — | 10/100/1000 Mbps with IEEE 1588 |
| USB | — | USB 2.0 High-Speed Host and Device |
| CAN | — | 2x CAN-FD |
| Crypto Accelerator | — | AES, SHA, TRNG; ARM TrustZone secure boot |
| 电源电压 | — | 0.9 V core / 1.8 V / 3.3 V I/O (typical) |
| Operating Temperature (Industrial) | — | -40C to +85C |
| Deep-Sleep Current | — | <5 uA with backup self-refresh |