EP1AGX35CF780I6N vs EP1AGX20CF780C6 对比

详细并排对比 EP1AGX35CF780I6N 出自 Intel 和 EP1AGX20CF780C6 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP1AGX35CF780I6N EP1AGX35CF780I6N - Arria GX FPGA, 33.5K LE, 780-BGA | Intel

EP1AGX35CF780I6N - Arria GX FPGA, 33.5K LE, 780-BGA | Intel

EP1AGX35CF780I6N ⚠ 最后一次采购
Altera
EP1AGX20CF780C6 EP1AGX20CF780C6 - Arria GX FPGA 21K LE 780-BGA | Intel | Altera

EP1AGX20CF780C6 - Arria GX FPGA 21K LE 780-BGA | Intel | Altera

EP1AGX20CF780C6 ⚠ 最后一次采购

规格对比

参数 EP1AGX35CF780I6N EP1AGX20CF780C6
品牌 Intel Altera
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $278.75 $175.40
Manufacturer Intel (formerly Altera) —
Family Arria GX Arria GX
Device Series EP1AGX35 —
Logic Elements (LE) 33,250 —
Logic Array Blocks (LABs) 33,520 —
Process Technology 90 nm 90 nm CMOS
Core Voltage 1.2 V —
Embedded Transceivers Up to 3.125 Gbps —
Transceiver Count [DATA_NEEDED: transceiver count for EP1AGX35 in F780 package] —
封装 780-pin Flip-Chip BGA (FC-FBGA) 780-ball FC-FBGA
Package Code BGA-780 —
Package Dimensions 29 x 29 mm —
Terminal Pitch 1.00 mm —
安装类型 Surface Mount Surface Mount (flip-chip BGA)
Terminal Form Ball —
Terminal Shape [DATA_NEEDED: terminal shape - confirmed SQUARE package per partstack] —
Temperature Grade Industrial —
工作温度范围 -40C to +100C (Industrial, I6 speed grade) —
Speed Grade I6 C6
RoHS 状态 [DATA_NEEDED: RoHS status not stated in verified sources] [DATA_NEEDED: rohs status]
Logic Elements — 21,580
Total RAM Bits — 1,229,184 bits
Total RAM Blocks — 341
Core Supply Voltage — 1.2 V
Transceiver Channels — Up to 8
Max Transceiver Data Rate — 3.125 Gbps
工作温度 — Commercial (0C to +85C)
MSL 等级 — [DATA_NEEDED: MSL level]
Embedded Multipliers (DSP Blocks) — [DATA_NEEDED: DSP block count]

数据手册与资源

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