EP20K100EFC324-2X vs EP20K100FC324-3 对比
详细并排对比 EP20K100EFC324-2X 出自 Intel 和 EP20K100FC324-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP20K100EFC324-2X | EP20K100FC324-3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $99.50 | $42.10 |
| Family | APEX 20KE | APEX 20K (non-KE) |
| Device Type | SPLD / FPGA (Field Programmable Gate Array) | — |
| System Gates | 100,000 gates | 100,000 |
| Logic Elements / Cells | 4,160 | — |
| Total RAM Bits | 53,248 bits | — |
| LABs / CLBs | 416 | — |
| Maximum User I/Os | 246 | — |
| Number of I/O Banks | 8 (per APEX 20KE family) | — |
| Propagation Delay | 1.6 ns | 1.6 ns |
| Internal Operating Frequency | Up to 250 MHz | — |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | MultiVolt: 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 0.22 µm CMOS (all-layer copper metal) | 0.22 µm CMOS |
| Speed Grade | -2X | -3 (slowest) |
| 封装 | 324-ball FBGA (FineLine BGA), 19x19 mm, 1.27 mm pitch | 324-pin FBGA (Fine-pitch BGA) |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) |
| Programming Interface | IEEE 1149.1 JTAG | IEEE 1149.1 JTAG |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG, Altera configuration EPROM | — |
| RoHS 状态 | [DATA_NEEDED: confirm against lot-specific documentation] | [DATA_NEEDED: RoHS status] |
| Series | — | APEX 20K |
| Logic Elements | — | 4,160 |
| Maximum Logic Blocks | — | 26 |
| Embedded Memory (RAM bits) | — | 53,248 |
| User I/O Pins | — | 252 |
| Total RAM bits | — | 53,248 |
| Core Supply Voltage | — | 2.5 V |
| Maximum Internal Frequency | — | 167 MHz |
| Package Body Size | — | 45 x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |