EP20K100FC324-3 vs EP20K100EFC324-2X 对比
详细并排对比 EP20K100FC324-3 出自 Intel 和 EP20K100EFC324-2X 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP20K100FC324-3 | EP20K100EFC324-2X |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $42.10 | $99.50 |
| Series | APEX 20K | — |
| Family | APEX 20K (non-KE) | APEX 20KE |
| System Gates | 100,000 | 100,000 gates |
| Logic Elements | 4,160 | — |
| Maximum Logic Blocks | 26 | — |
| Embedded Memory (RAM bits) | 53,248 | — |
| User I/O Pins | 252 | — |
| Total RAM bits | 53,248 | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS (all-layer copper metal) |
| Core Supply Voltage | 2.5 V | — |
| Maximum Internal Frequency | 167 MHz | — |
| Propagation Delay | 1.6 ns | 1.6 ns |
| Speed Grade | -3 (slowest) | -2X |
| 封装 | 324-pin FBGA (Fine-pitch BGA) | 324-ball FBGA (FineLine BGA), 19x19 mm, 1.27 mm pitch |
| Package Body Size | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| 工作温度 | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) |
| Programming Interface | IEEE 1149.1 JTAG | IEEE 1149.1 JTAG |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: confirm against lot-specific documentation] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Device Type | — | SPLD / FPGA (Field Programmable Gate Array) |
| Logic Elements / Cells | — | 4,160 |
| Total RAM Bits | — | 53,248 bits |
| LABs / CLBs | — | 416 |
| Maximum User I/Os | — | 246 |
| Number of I/O Banks | — | 8 (per APEX 20KE family) |
| Internal Operating Frequency | — | Up to 250 MHz |
| Core Supply Voltage (VCCINT) | — | 1.8 V |
| I/O Supply Voltage (VCCIO) | — | MultiVolt: 1.8 V / 2.5 V / 3.3 V |
| Configuration Modes | — | Passive Serial, Passive Parallel, JTAG, Altera configuration EPROM |