EP2A15B724C9 vs EP2A15F672C7AA 对比
详细并排对比 EP2A15B724C9 出自 Intel 和 EP2A15F672C7AA 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2A15B724C9 | EP2A15F672C7AA |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $268.50 | $215.00 |
| Series | APEX II | — |
| Family | APEX II (EP2A15) | APEX II |
| Logic Elements | 16640 | — |
| Number of Gates | 600000 | — |
| Embedded Memory (RAM bits) | 425984 | — |
| User I/O Count | 492 | — |
| Supply Voltage (Core) | 1.5 V | — |
| I/O Voltages Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | — |
| Process Technology | 0.15 µm all-layer copper (up to 8 metal layers) | 0.15 micrometer all-layer copper (up to 8 metal layers) |
| Maximum Internal Frequency | 500 MHz | — |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | 1 Gbps True-LVDS |
| Interface Standards | LVDS, LVPECL, PCML, HyperTransport | — |
| Embedded Memory Type | ESB - dual-port RAM / ROM / FIFO / CAM | — |
| Clock Management | On-chip PLLs | — |
| 封装 | 724-ball FCBGA (Fine-pitch Chip-Scale BGA) | 672-ball FC-FBGA (flip-chip) |
| 工作温度 | Commercial (0 °C to +85 °C) | — |
| 安装类型 | Surface Mount | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant (per Full-Electronic listing) |
| Typical Gates | — | 600K |
| Maximum System Gates | — | 1.4M |
| Logic Elements (LEs) | — | 16,640 |
| Maximum User I/O | — | 492 |
| Operating Frequency (internal) | — | 500 MHz |
| Core Voltage | — | 1.5 V |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, PCI-X, SSTL, HSTL, LVDS, LVPECL, PCML, HyperTransport |
| MultiVolt I/O Bank Voltages | — | 1.5V / 1.8V / 2.5V / 3.3V |
| Embedded Memory | — | Dual-port RAM blocks + CAM blocks |
| PLLs | — | 4 enhanced PLLs |
| Programming Interfaces | — | Passive Serial, Fast Passive Parallel, JTAG (IEEE 1149.1) |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Lifecycle | — | Last-Time-Buy / EOL announced Nov-Dec 2016 |