EP2AGX125EF35I3G vs EP2AGX125EF29I5G 对比
详细并排对比 EP2AGX125EF35I3G 出自 Intel 和 EP2AGX125EF29I5G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2AGX125EF35I3G | EP2AGX125EF29I5G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $410.39 | $861.62 |
| Series | Arria II GX | — |
| Logic Elements | 118143 LE | 118,143 |
| Adaptive Logic Modules (ALMs) | 49640 ALM | — |
| Embedded Memory | 7.93 Mbit | — |
| Total RAM Bits | 8315904 bit | — |
| Number of I/O | 452 | — |
| 封装 / 外壳 | 1152-BBGA, FCBGA | — |
| 安装方式 | SMD/SMT | — |
| 工作温度 | -40C to +100C (Industrial) | — |
| Speed Grade | I3 | — |
| Process Node | 40 nm | — |
| Packaging | Tray | — |
| RoHS 状态 | Compliant | Compliant |
| Lead Free | Yes | — |
| Transceivers | Up to 8 SERDES channels (per family) | — |
| Family | — | Arria II GX |
| Embedded Memory Bits | — | 8,315,904 |
| User I/O Pins | — | 372 |
| 封装 | — | 780-ball FCBGA (Flip-Chip BGA), 29x29 mm |
| Process Technology | — | 40 nm |
| Core Voltage (VCCINT) | — | 0.9 V |
| Transceivers (GX) | — | Up to 12 (3.75 Gbps) |
| Operating Temperature Grade | — | Industrial (I5): -40C to +100C |
| DSP Blocks | — | Yes (18x18 hardware multipliers) |
| PLL Count | — | Multiple per device (family-dependent) |
| External Memory Support | — | DDR/DDR2/DDR3, QDR II, RLDRAM II |
| Hard IP Blocks | — | PCI Express Gen1/Gen2 (PIPE), memory controllers |
| Configuration Scheme | — | JTAG, AS, PS, FPP |
| 安装类型 | — | Surface Mount (BGA) |