EP2S130F1020C3 vs EP2S180F1020C3TT 对比
详细并排对比 EP2S130F1020C3 出自 Intel 和 EP2S180F1020C3TT 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2S130F1020C3 | EP2S180F1020C3TT |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,295.00 | $365.00 |
| Series | Stratix II | EP2S180 |
| Family | Stratix II | Stratix II |
| Logic Elements / Cells | 132,540 | — |
| Logic Array Blocks (LABs) | 6,627 | — |
| User I/Os | 742 | — |
| Embedded Memory (TriMatrix) | [DATA_NEEDED: total Mbits] | — |
| DSP / Multiplier Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | Logic-rich SKU (no transceiver; transceiver variants use different suffix) | — |
| Maximum Internal Frequency | 778.82 MHz (per family datasheet) | — |
| Process Technology | 90 nm | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| 封装 / 外壳 | 1020-BBGA (FC-FBGA), 33x33 mm | — |
| Supplier Device Package | 1020-FBGA (33x33) | — |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | 0C to +85C (commercial, 'C' speed grade) | — |
| Speed Grade | C3 (commercial, -3 speed) | C3 |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| MSL 等级 | [DATA_NEEDED: MSL level] | [DATA_NEEDED: moisture sensitivity level] |
| Logic Elements (LEs) | — | 179,400 |
| Total Memory Bits | — | 9,383,040 |
| User I/O Count | — | 742 |
| 封装 | — | 1020-BBGA (FineLine BGA) |
| Operating Temperature Grade | — | Commercial / Industrial (per suffix) |
| Process Node | — | 90 nm |
| Configuration | — | SRAM-based, in-system reconfigurable |
| Lead-Free | — | Yes |
| Logic Block Architecture | — | Adaptive Logic Module (ALM), 8-input fracturable LUT |