EP2S180F1020C3 vs EP2S130F1020C3 对比
详细并排对比 EP2S180F1020C3 出自 Intel 和 EP2S130F1020C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2S180F1020C3 | EP2S130F1020C3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,280.00 | $1,295.00 |
| Series | Stratix II | Stratix II |
| Device Family | EP2S180 | — |
| Equivalent Logic Elements (LEs) | 179,400 | — |
| Logic Array Blocks (LABs) | 8,970 | 6,627 |
| Embedded Memory (RAM bits) | 9,383,040 | — |
| Maximum User I/Os | 742 | — |
| 封装 | 1020-ball FBGA (flip-chip BGA) | — |
| 安装类型 | Surface Mount | Surface Mount |
| Process Node | 90 nm, all-layer copper SRAM | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | C3 | C3 (commercial, -3 speed) |
| 工作温度 | Commercial (0C to +85C) | 0C to +85C (commercial, 'C' speed grade) |
| DSP Blocks | Dedicated high-speed multipliers | — |
| Memory Interfaces Supported | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| I/O Standards | LVDS, LVPECL, SSTL, HSTL | — |
| Configuration Method | SRAM-based (volatile, requires boot device) | — |
| Development Toolchain | Quartus II / Quartus Prime | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Family | — | Stratix II |
| Logic Elements / Cells | — | 132,540 |
| User I/Os | — | 742 |
| Embedded Memory (TriMatrix) | — | [DATA_NEEDED: total Mbits] |
| DSP / Multiplier Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | Logic-rich SKU (no transceiver; transceiver variants use different suffix) |
| Maximum Internal Frequency | — | 778.82 MHz (per family datasheet) |
| Process Technology | — | 90 nm |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V |
| 封装 / 外壳 | — | 1020-BBGA (FC-FBGA), 33x33 mm |
| Supplier Device Package | — | 1020-FBGA (33x33) |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |