EP2S180F1020I4 vs EP2S130F1020I4N 对比
详细并排对比 EP2S180F1020I4 出自 Intel 和 EP2S130F1020I4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2S180F1020I4 | EP2S130F1020I4N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 停产 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $11,250.00 | $1,380.00 |
| Series | Stratix II | — |
| Family | Stratix II (EP2S180) | Stratix II |
| Logic Elements | 179,400 | 132,540 |
| Number of LABs/CLBs | 8,970 | — |
| Total RAM Bits | 9,383,040 (8,979,840 per alternate sources) | 6,747,840 |
| Number of I/O | 742 | — |
| Number of DSP Blocks | [DATA_NEEDED: DSP block count per Stratix II EP2S180 datasheet - typically 12] | — |
| Number of PLLs | [DATA_NEEDED: PLL count per EP2S180 datasheet] | — |
| Core Voltage (VCCINT) | 1.2 V | 1.15 V to 1.25 V |
| Process Technology | 90 nm CMOS | — |
| Maximum Operating Frequency | 711.24 MHz | — |
| 工作温度 | -40C to +100C (Industrial grade, "I4" suffix) | -40C to +100C (TJ, Industrial) |
| 封装 | 1020-BBGA, FC-FBGA (Flip-Chip FineLine BGA) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| MSL 等级 | [DATA_NEEDED: MSL rating from Altera packaging spec] | — |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | Yes | [DATA_NEEDED: lead-free / lead-bearing finish] |
| Configuration Method | Passive serial, Active serial, Fast passive parallel, JTAG | — |
| Configuration Memory Type | SRAM (volatile; requires external configuration device) | — |
| Supplier Device Package | 1020-FBGA | 1020-FBGA |
| Base Part Number | EP2S180 | — |
| Logic Array Blocks (LABs) | — | 6,627 |
| User I/O Count | — | 742 |
| 封装 / 外壳 | — | 1020-BBGA (FineLine BGA, FC-FBGA) |
| Process Node | — | 90 nm |
| Internal Operating Frequency | — | up to 711.24 MHz |
| Speed Grade | — | I4 (Industrial, speed bin 4) |
| Configuration | — | SRAM-based, volatile configuration memory |
| Design Software | — | Quartus II (legacy) |