EP2S30F672C3 vs EP2S30F672C5N 对比
详细并排对比 EP2S30F672C3 出自 Intel 和 EP2S30F672C5N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2S30F672C3 | EP2S30F672C5N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $780.00 | $450.00 |
| Series | Stratix II | Stratix II |
| Number of Logic Elements | 33,880 | — |
| Number of Adaptive Logic Modules (ALMs) | 13,560 | — |
| Total Embedded Memory Bits | 1,369,728 | — |
| Embedded Memory (M512 / M4K / M-RAM blocks) | M512, M4K, M-RAM TriMatrix | — |
| Total RAM Bits | 1,369,728 | — |
| Number of User I/O | 500 | — |
| Number of Transceivers | [DATA_NEEDED: depends on variant - up to 12] | — |
| DSP Blocks | Dedicated 18x18 multipliers | [DATA_NEEDED: DSP block count] |
| DSP Performance | Up to 156 GMACs | — |
| Voltage - Supply | 1.2 V core, multi-rail I/O | — |
| 工作温度 | 0C to +85C (Commercial) | — |
| Speed Grade | -3 | C5 (-5 commercial) |
| 封装 / 外壳 | 672-BBGA, FCBGA (FineLine BGA) | — |
| 安装类型 | Surface Mount | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| RoHS 状态 | Non-compliant (leaded BGA) | — |
| MSL 等级 | [DATA_NEEDED: MSL rating] | — |
| Family Name | — | Stratix II |
| Logic Elements | — | 33,880 |
| Embedded Memory (bits) | — | 1,369,728 |
| Logic Array Blocks (LABs) | — | 1694 |
| User I/O Count | — | 500 |
| 封装 | — | 672-ball FBGA (FineLine BGA) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core VCC value] |
| 工作温度范围 | — | Commercial (0C to +85C) |
| Number of PLLs | — | 4 |
| Global Clock Networks | — | 16 |
| Configuration Method | — | Serial / Passive Parallel / Fast Passive Parallel |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Architecture | — | Adaptive Logic Module (ALM) |
| Multipliers | — | [DATA_NEEDED: 18x18 multiplier count] |