EP2SGX30CF780C6 vs EP2SGX30CF780I5N 对比
详细并排对比 EP2SGX30CF780C6 出自 Intel 和 EP2SGX30CF780I5N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2SGX30CF780C6 | EP2SGX30CF780I5N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $165.00 | $1,050.00 |
| Family | Stratix II GX | — |
| Series | EP2SGX | — |
| Logic Elements (LE) | 33,880 | — |
| Adaptive Logic Modules (ALM) | 13,540 | — |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) | — |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) | — |
| User I/O Pins | 361 | — |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| 封装 | 780-ball FineLine BGA (F780) | FC-FBGA-780 |
| Speed Grade | C6 (commercial, mid-speed) | — |
| 工作温度 | 0C to +85C (commercial) | -40C to +85C (Industrial) |
| Core Voltage | 1.2 V (typical) | — |
| Configuration Mode | Enhanced passive/active (EPC) supported | — |
| Process Technology | 90 nm | 90 nm CMOS |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Cells | — | 33,880 |
| Logic Array Blocks (LABs) | — | 33,880 |
| Internal Frequency | — | 622 MHz max |
| Combinatorial Delay per LAB | — | 4.006 ns |
| Core Supply Voltage | — | 1.2 V |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Terminal Form | — | Ball (BGA) |
| Logic Family | — | CMOS, Stratix II GX |
| Number of Terminals | — | 780 |
| 安装类型 | — | Surface Mount (Flip-Chip BGA) |
| Transceivers | — | Integrated multi-gigabit serial transceivers |
| Embedded Memory | — | TriMatrix memory blocks |
| DSP Blocks | — | Integrated DSP blocks |