EP2SGX30CF780I3 vs EP2SGX30CF780C5 对比

详细并排对比 EP2SGX30CF780I3 出自 Intel 和 EP2SGX30CF780C5 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP2SGX30CF780I3 EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 ⚠ 最后一次采购
Intel
EP2SGX30CF780C5 EP2SGX30CF780C5 - Stratix II GX FPGA, 33.88K LE, 780-FBGA | Intel

EP2SGX30CF780C5 - Stratix II GX FPGA, 33.88K LE, 780-FBGA | Intel

EP2SGX30CF780C5 ⚠ 最后一次采购

规格对比

参数 EP2SGX30CF780I3 EP2SGX30CF780C5
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $171.00 $248.00
Family Stratix II GX Stratix II GX
Logic Cells 33,880 —
Logic Array Blocks (LABs) 33,880 1694
Maximum Internal Frequency 622.08 MHz —
Number of User I/O Pins 361 —
Process Technology 90 nm CMOS 90 nm
Core Voltage 1.2 V 1.2 V
Transceivers Embedded multi-gigabit transceivers (6.375 Gbps) Multi-gigabit transceivers with embedded CDR
封装 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) 780-ball FBGA
Terminal Pitch 1.0 mm —
工作温度 -40 °C to +85 °C (Industrial) —
Temperature Grade Suffix I3 (Industrial) —
安装类型 Surface Mount (BGA) Surface Mount
Total Terminals 780 —
Package Code BGA, square shape —
RoHS 状态 [DATA_NEEDED: RoHS status not confirmed in supplied data] [DATA_NEEDED: RoHS status]
Logic Elements — 33880
Maximum User I/O Pins — 361
Operating Temperature Grade — Commercial (0C to +85C)
Speed Grade — -5
PLLs — 4
Embedded Memory — M512 / M4K / M-RAM blocks (totals per datasheet)
DSP Blocks — Embedded multiplier/DSP blocks
Lead-Free — [DATA_NEEDED: lead-free status]

数据手册与资源

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