EP2SGX60CF780C4 vs EP2SGX60CF780C5N 对比
详细并排对比 EP2SGX60CF780C4 出自 Intel 和 EP2SGX60CF780C5N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EP2SGX60CF780C5N - Stratix II GX FPGA, 60K LE, 6.375 Gbps SERDES | Intel
EP2SGX60CF780C5N ⚠ 最后一次采购规格对比
| 参数 | EP2SGX60CF780C4 | EP2SGX60CF780C5N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $171.00 | $485.00 |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | 60,440 (60K LE) |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 3,022 | — |
| User I/O Count | 364 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | [DATA_NEEDED: number of transceivers] | — |
| Internal Operating Frequency | up to 732.1 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| 封装 | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) | 780-BBGA, FCBGA (29 mm x 29 mm, 1.0 mm pitch) |
| Package Type | Flip-Chip Fine-Pitch BGA | — |
| Speed Grade | C4 (commercial) | — |
| 工作温度 | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance] | Compliant |
| Series | — | Stratix II GX |
| Logic Array Blocks (LABs) | — | 3022 |
| Total RAM Bits | — | 2,544,192 (approximately 2.5 Mbit) |
| User I/Os | — | 364 |
| High-Speed Transceiver Channels | — | 20 (up to 6.375 Gbps per channel) |
| Core Voltage | — | 1.15 V to 1.25 V |
| Internal Frequency (max) | — | 717 MHz |
| Configuration Interface | — | JTAG (IEEE 1149.1), passive/active serial |
| Operating Temperature Grade | — | Commercial (C) |
| Transceiver Data Rate | — | Up to 6.375 Gbps |