EP2SGX90EF1152C3ES vs EP2SGX90EF1152C3N 对比

详细并排对比 EP2SGX90EF1152C3ES 出自 Intel 和 EP2SGX90EF1152C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP2SGX90EF1152C3ES EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel

EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel

EP2SGX90EF1152C3ES ⚠ 最后一次采购

规格对比

参数 EP2SGX90EF1152C3ES EP2SGX90EF1152C3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 有效
库存状态 有库存 有库存
单价(USD) $2,050.00 $1,280.00
Family Stratix II GX Stratix II GX
Process Node 90 nm —
Logic Elements 90,960 —
Embedded Memory 4,520,448 bits (approx. 4.5 Mbit) —
User I/O Pins 558 —
封装 1152-BBGA (FineLine BGA, 35x35 mm) —
Speed Grade C3 EF
Temperature Grade Commercial Extended (-40 C to +100 C) C3 (Commercial)
Core Voltage 1.5 V (Enhanced, 'E' suffix) 1.2 V
High-Speed Transceivers Up to 12 channels (per Stratix II GX family) —
Transceiver Data Rate Up to 6.375 Gbps per channel (family spec) —
DSP Blocks Yes, dedicated 18x18 multipliers and accumulators —
PLL Count [DATA_NEEDED: PLL count for EP2SGX90 variant] —
User I/O Banks 24 (per package datasheet) —
Configuration SRAM-based, supports Fast Passive Parallel, Fast Active Serial, JTAG —
安装类型 Surface Mount (BGA) Surface Mount
RoHS 状态 Compliant —
Lead-Free Yes —
Series — Stratix II GX
Logic Elements (LE) — 90960
Number of LABs/CLBs — 4548
Total Memory Bits — 4520448
User I/Os — 558
Number of Transceivers — [DATA_NEEDED: transceiver count per family]
Process Technology — 90 nm
Operating Frequency (max) — 816.9 MHz
工作温度 — 0C to +85C (Commercial)
Package Type — FC-FBGA (Flip-Chip Fine-pitch BGA)
Package Pin Count — 1152 balls
Package Dimensions — 34 mm x 34 mm
Lead-Free / RoHS — Yes (RoHS compliant)

数据手册与资源

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