EP2SGX90EF1152C4N vs EP2SGX90EF1152I2N 对比

详细并排对比 EP2SGX90EF1152C4N 出自 Intel 和 EP2SGX90EF1152I2N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP2SGX90EF1152C4N EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel

EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel

EP2SGX90EF1152C4N ⚠ 最后一次采购
Intel
EP2SGX90EF1152I2N EP2SGX90EF1152I2N - 90,960 LEs Stratix II GX FPGA | Intel

EP2SGX90EF1152I2N - 90,960 LEs Stratix II GX FPGA | Intel

EP2SGX90EF1152I2N ✓ 量产中

规格对比

参数 EP2SGX90EF1152C4N EP2SGX90EF1152I2N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 有效
库存状态 有库存 有库存
单价(USD) $695.00 $1,320.00
Family Stratix II GX Stratix II GX
Logic Elements (LE) 90,960 —
LABs/CLBs 4,548 —
Total RAM Bits 4,520,448 bits —
User I/O Count 558 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Core Voltage 1.2 V 1.2 V
Process Node 90 nm 90 nm
Transceivers Up to 20 channels, 6.375 Gbps per channel Up to 12 high-speed serial channels (family spec)
Speed Grade C4 —
工作温度 Commercial (0C to +85C) —
封装 1152-BBGA / FC-FBGA-1152 1152-BBGA (FC-FBGA, flip-chip)
安装类型 Surface Mount (BGA) Surface Mount (BGA)
MSL 等级 MSL-3 / MS-034AAR-1 (per package outline) —
Lead-Free / RoHS Lead free; RoHS compliance per JEDEC —
Manufacturer — Intel (formerly Altera)
Logic Elements — 90,960
Logic Array Blocks (LABs) — 4,548
Total Embedded RAM Bits — 4,520,448 bits
User I/Os — 558
Operating Temperature Grade — Industrial (I2)
RoHS 状态 — Compliant
Lead-Free — Yes
生命周期状态 — Active (Stratix II GX family)

数据手册与资源

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