EP2SGX90EF1152I2N vs EP2SGX90EF1152C3N 对比

详细并排对比 EP2SGX90EF1152I2N 出自 Intel 和 EP2SGX90EF1152C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP2SGX90EF1152I2N EP2SGX90EF1152I2N - 90,960 LEs Stratix II GX FPGA | Intel

EP2SGX90EF1152I2N - 90,960 LEs Stratix II GX FPGA | Intel

EP2SGX90EF1152I2N ✓ 量产中

规格对比

参数 EP2SGX90EF1152I2N EP2SGX90EF1152C3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $1,320.00 $1,280.00
Family Stratix II GX Stratix II GX
Manufacturer Intel (formerly Altera) —
Logic Elements 90,960 —
Logic Array Blocks (LABs) 4,548 —
Total Embedded RAM Bits 4,520,448 bits —
User I/Os 558 558
封装 1152-BBGA (FC-FBGA, flip-chip) —
Core Voltage 1.2 V 1.2 V
Operating Temperature Grade Industrial (I2) —
Process Node 90 nm —
Transceivers Up to 12 high-speed serial channels (family spec) —
安装类型 Surface Mount (BGA) Surface Mount
RoHS 状态 Compliant —
Lead-Free Yes —
生命周期状态 Active (Stratix II GX family) —
Series — Stratix II GX
Logic Elements (LE) — 90960
Number of LABs/CLBs — 4548
Total Memory Bits — 4520448
Number of Transceivers — [DATA_NEEDED: transceiver count per family]
Process Technology — 90 nm
Operating Frequency (max) — 816.9 MHz
工作温度 — 0C to +85C (Commercial)
Package Type — FC-FBGA (Flip-Chip Fine-pitch BGA)
Package Pin Count — 1152 balls
Package Dimensions — 34 mm x 34 mm
Lead-Free / RoHS — Yes (RoHS compliant)
Speed Grade — EF
Temperature Grade — C3 (Commercial)

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