EP3CLS100F484C7N vs EP3CLS70F484C7N 对比
详细并排对比 EP3CLS100F484C7N 出自 Intel 和 EP3CLS70F484C7N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3CLS100F484C7N | EP3CLS70F484C7N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $495.80 | $96.30 |
| Family | Cyclone III LS | — |
| Logic Elements | 100,448 | — |
| Embedded Memory (bits) | 4,451,328 | — |
| User I/O Pins | 278 | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| PLLs | 4 | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Process Technology | 65 nm low-power (TSMC) | TSMC 65nm low-power (LP) |
| Core Supply Voltage | 1.2 V | — |
| Operating Temperature (junction) | 0°C to +85°C (commercial) | — |
| Speed Grade | C7 | — |
| 封装 | 484-ball FineLine BGA (FBGA-484) | — |
| Ball Pitch | 1.0 mm | — |
| Package Dimensions | [DATA_NEEDED: package body dimensions] | 19 x 19 mm, 1.0 mm ball pitch |
| Configuration Method | SRAM-based (volatile), via EPCS/JTAG/parallel flash | JTAG / Passive Serial / Active Serial |
| Security Features | Bitstream encryption, JTAG tamper protection | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant (lead-free, N suffix) | Compliant (per Intel product page) |
| Design Software | Quartus II / Intel Quartus Prime | — |
| Device Family | — | Cyclone® III LS |
| Logic Elements (LE) | — | 70,208 |
| Logic Array Blocks (LABs) | — | 4,388 |
| Embedded Memory Bits | — | 3,068,928 |
| Maximum User I/Os | — | 278 |
| Maximum Operating Frequency | — | 437.5 MHz |
| Core Supply Voltage (VCCINT) | — | 1.2 V |
| Package Type | — | 484-ball FineLine BGA (FBGA-484) |
| 工作温度 | — | [DATA_NEEDED: commercial/industrial grade] |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |
| Design Tool | — | Intel Quartus II (Cyclone III support) |