EP3CLS100F780C7 vs EP3C55F780C7N 对比
详细并排对比 EP3CLS100F780C7 出自 Intel 和 EP3C55F780C7N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3CLS100F780C7 | EP3C55F780C7N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $632.40 | $138.31 |
| Family | Cyclone III LS | Cyclone III |
| Logic Elements (LEs) | 100,448 | — |
| Total RAM Bits | 4,451,328 | — |
| Embedded Memory | M9K blocks (488 total, 4,451,328 bits) | 2,396,160 bits (approximately 2.4 Mbit) |
| Embedded 18x18 Multipliers | 66 | — |
| Maximum User I/O Pins | 413 | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: exact LAB count for EP3CLS100] | — |
| 封装 | 780-ball FineLine BGA (FBGA-780) | 780-ball FineLine BGA |
| Package Dimensions | 29 mm x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| I/O Supply Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Process Technology | 60 nm low-power CMOS | 65 nm low-power CMOS |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | — |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | — |
| 工作结温 | 0C to +85C (commercial, 'C' grade) | — |
| RoHS 状态 | Compliant (lead-free FBGA) | Compliant |
| Speed Grade | 7 (C7) | 7 |
| Logic Elements | — | 55,856 |
| Embedded Memory Blocks | — | 312 M9K blocks |
| Embedded Multipliers | — | 156 (18 x 18) |
| User I/O Count | — | 377 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Configuration Memory | — | 8 Kbits (supports PS, FPP, JTAG) |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Bank Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
| 工作温度 | — | 0C to +85C (commercial, C7 speed grade) |