EP3CLS200F780I7N vs EP3CLS200F780I8N 对比
详细并排对比 EP3CLS200F780I7N 出自 Intel 和 EP3CLS200F780I8N 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3CLS200F780I7N | EP3CLS200F780I8N |
|---|---|---|
| 品牌 | Intel | Altera |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $240.00 | $495.00 |
| Device Family | Cyclone III LS | — |
| Series | EP3CLS200 | — |
| Logic Elements | 198,464 | — |
| Logic Array Blocks (LABs) | 12,404 LAB | 47 (per FPGAkey brief) |
| Embedded Memory (bits) | 8,211,456 | — |
| Embedded Multipliers | 425 (18x18) | — |
| PLLs | 4 | — |
| Maximum User I/O | 413 | — |
| Process Technology | 65 nm CMOS (low-power) | 65 nm CMOS |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | 1.2 V |
| Speed Grade | 7 | 8 |
| 工作温度 | -40 °C to +100 °C (industrial) | -40 °C to +100 °C (Industrial) |
| Maximum Internal Frequency | [DATA_NEEDED: maximum internal frequency MHz] | — |
| 封装 | 780-ball FBGA (FBGA-780) | 780-ball FBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant (lead-free per FBGA-780 datasheet note) | — |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | — |
| Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 198,464 |
| Embedded Memory (Bits) | — | 8,211,456 |
| Maximum Internal Clock Frequency | — | 402 MHz |
| Package Code | — | S-PBGA-B780 (JESD-30) |
| Package Body Size | — | 29.0 mm x 29.0 mm |
| Seated Height (Max) | — | 2.40 mm |
| RoHS / Lead-Free | — | Pb-free / RoHS compliant |
| Configuration Method | — | Passive/Active Serial, JTAG |