EP3SE110F1152C4N vs EP3SE110F1152I3N 对比
详细并排对比 EP3SE110F1152C4N 出自 Intel 和 EP3SE110F1152I3N 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
EP3SE110F1152C4N ⚠ 最后一次采购Altera
EP3SE110F1152I3N - Stratix III E FPGA, 107K LE, 1152-FCBGA | Altera
EP3SE110F1152I3N ⚠ 最后一次采购规格对比
| 参数 | EP3SE110F1152C4N | EP3SE110F1152I3N |
|---|---|---|
| 品牌 | Intel | Altera |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,395.00 | $3,980.00 |
| Family | Stratix III Enhanced (E) | Stratix III E FPGA |
| Logic Elements | 107,500 | — |
| Memory Bits | 8,936,448 | — |
| Embedded Multipliers (18x18) | 896 | — |
| Logic Array Blocks (LABs) | 4300 | 4300 |
| User I/O Pins | 744 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm CMOS |
| Maximum Operating Frequency | 450 MHz | — |
| 封装 | 1152-ball FCBGA (Flip-Chip BGA) | 1152-ball FC-FBGA (Flip-Chip Fine-pitch BGA) |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | 0C to +85C (Commercial) | — |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG / AES-256 | — |
| RoHS 状态 | Compliant | — |
| MSL 等级 | 3 (168 hours) | — |
| Design Software | Quartus II (v9.1 or later) | — |
| Series | — | Stratix III E |
| Manufacturer | — | Altera (now Intel PSG) |
| Logic Elements (LE) | — | 107,500 |
| Total RAM Bits | — | 8,936,448 |
| Maximum User I/Os | — | 744 |
| Number of I/O Banks | — | Modular I/O banks (see Stratix III Device Handbook) |
| 工作温度范围 | — | -40C to +100C (industrial, I3 grade) |
| Speed Grade | — | -3 (I3 fast grade, industrial) |
| Lead-Free / RoHS | — | Lead-free (N suffix); RoHS compliance status: see Stratix III Device Handbook |
| Configuration | — | JTAG via Quartus II; supports AS, PS, JTAG, FPP modes |
| Internal Supply Voltage (Max) | — | 0.94 V (per Partstack listing) |