EP3SE260F1152C3 vs EP3SE260F1152I3G 对比
详细并排对比 EP3SE260F1152C3 出自 Intel 和 EP3SE260F1152I3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260F1152C3 | EP3SE260F1152I3G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $12,500.00 | $1,240.00 |
| Series | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/Os | 744 | — |
| Embedded 18x18 Multipliers | 384 | — |
| 封装 | 1152-ball FCBGA (Flip-Chip BGA) | 1152-BBGA, FCBGA (FineLine BGA) |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Core Voltage | 0.9 V to 1.1 V | — |
| Process Technology | 40 nm | 40 nm TSMC low-power |
| 工作温度 | 0C to +85C (Commercial) | — |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG | — |
| PLLs | 12 | — |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS compliance not stated in scraped data] |
| Speed Grade | C3 | I3 (Industrial, balanced) |
| Family | — | Stratix III |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory Bits | — | 16,672,640 bits |
| Embedded Memory Bits (alternate) | — | 20,880 Kb (16,672,640 / 1024) |
| User I/O Count | — | 744 |
| 工作温度范围 | — | -40C to +100C (Industrial) |
| Supply Voltage Core | — | 0.9 V (typical, see handbook) |
| Configuration Bitstream Encryption | — | AES-256 (Stratix III feature) |
| I/O Standards Supported | — | LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X |
| 湿敏等级（MSL） | — | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] |
| Lead-Free Reflow | — | [DATA_NEEDED: peak reflow temperature] |
| Design Toolchain | — | Quartus II / Quartus Prime |
| Country of Origin / Distribution | — | Multiple authorized distributors (DigiKey, Mouser) |