EP3SE260F1152C3NES vs EP3SE260F1152C3 对比

详细并排对比 EP3SE260F1152C3NES 出自 Altera 和 EP3SE260F1152C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Altera
EP3SE260F1152C3NES EP3SE260F1152C3NES - Stratix III E FPGA 255K LE 1152-FBGA | Altera

EP3SE260F1152C3NES - Stratix III E FPGA 255K LE 1152-FBGA | Altera

EP3SE260F1152C3NES ⚠ 最后一次采购
Intel
EP3SE260F1152C3 EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 ⚠ 最后一次采购

规格对比

参数 EP3SE260F1152C3NES EP3SE260F1152C3
品牌 Altera Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $2,120.00 $12,500.00
Manufacturer Altera (now Intel FPGA) —
Series Stratix III E Stratix III E
Family Stratix III Enhanced —
Logic Elements (LE) 255,000 —
Embedded Memory Bits 16,672,768 —
Logic Array Blocks (LABs) 10,200 10,200
Number of I/Os 744 —
Maximum Operating Frequency 500 MHz —
Process Technology 65 nm 40 nm
Core Supply Voltage 1.1 V —
Number of 18x18 Multipliers 768 —
Number of PLLs 12 —
Package Type 1152-ball FBGA (FineLine BGA) —
Pin/Package Designator F1152 —
Speed Grade -3 (faster) C3
Hard Memory Controllers 4 —
Hard PCIe Blocks 4 —
External Memory Interface DDR3, DDR2, DDR, QDRII+, RLDRAM2 —
Operating Temperature Grade Commercial —
安装类型 Surface Mount Surface Mount
RoHS 状态 Compliant Compliant
Lead-Free Yes —
Logic Elements — 255,000
Embedded Memory (bits) — 16,672,768
User I/Os — 744
Embedded 18x18 Multipliers — 384
封装 — 1152-ball FCBGA (Flip-Chip BGA)
Core Voltage — 0.9 V to 1.1 V
工作温度 — 0C to +85C (Commercial)
Configuration Method — Passive Serial / Fast Passive Parallel / JTAG
PLLs — 12

数据手册与资源

浏览全部产品 创建 BOM 获取报价