EP3SE260F1152I3G vs EP3SE260F1152C2N 对比
详细并排对比 EP3SE260F1152I3G 出自 Intel 和 EP3SE260F1152C2N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260F1152I3G | EP3SE260F1152C2N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,240.00 | $11,000.00 |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III | FPGA - Field Programmable Gate Array |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory Bits | 16,672,640 bits | — |
| Embedded Memory Bits (alternate) | 20,880 Kb (16,672,640 / 1024) | — |
| User I/O Count | 744 | — |
| 封装 | 1152-BBGA, FCBGA (FineLine BGA) | — |
| 工作温度范围 | -40C to +100C (Industrial) | — |
| Speed Grade | I3 (Industrial, balanced) | — |
| Process Technology | 40 nm TSMC low-power | 65 nm |
| Supply Voltage Core | 0.9 V (typical, see handbook) | — |
| Configuration Bitstream Encryption | AES-256 (Stratix III feature) | — |
| I/O Standards Supported | LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance not stated in scraped data] | Compliant |
| 湿敏等级（MSL） | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | — |
| Lead-Free Reflow | [DATA_NEEDED: peak reflow temperature] | — |
| Design Toolchain | Quartus II / Quartus Prime | — |
| Country of Origin / Distribution | Multiple authorized distributors (DigiKey, Mouser) | — |
| Number of Logic Elements | — | 255000 |
| Number of LABs/CLBs | — | 10200 |
| Total Memory Bits | — | 16672768 |
| Number of I/O | — | 744 |
| Voltage - Supply | — | 1.1 V |
| 工作温度 | — | [DATA_NEEDED: operating temperature grade] |
| 封装 / 外壳 | — | 1152-BBGA, FCBGA |
| Maximum Frequency | — | 600 MHz |
| Supplier Device Package | — | 1152-FCBGA |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |
| Lead Free | — | Yes (per EP3SE260F1152C2G comparison) |
| ECCN | — | [DATA_NEEDED: ECCN code] |
| Moisture Sensitivity | — | [DATA_NEEDED: MSL level] |