EP3SE260F1517C3 vs EP3SE260F1517C4LN 对比
详细并排对比 EP3SE260F1517C3 出自 Intel 和 EP3SE260F1517C4LN 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260F1517C3 | EP3SE260F1517C4LN |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $10,800.00 | $1,450.00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | — |
| Process Node | 65 nm (TSMC) | — |
| 封装 | 1517-BBGA, FCBGA (FineLine BGA) | — |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 3 | C4 |
| Configuration | SRAM-based, requires external configuration device | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (flip-chip) |
| RoHS 状态 | Compliant | Compliant |
| Family | — | Stratix III E (Enhanced) |
| Number of LABs/CLBs | — | 10,200 |
| Total Memory Bits | — | 16,672,768 (16.67 Mbit) |
| Number of I/O | — | 976 |
| Number of Gates | — | [DATA_NEEDED: gate count not published in web data] |
| Voltage - Supply | — | 0.9 V to 1.1 V core |
| Operating Frequency | — | 375 MHz to 450 MHz (per family) |
| Process Technology | — | 65 nm |
| 封装 / 外壳 | — | 1517-BBGA, FCBGA (FC-FBGA) |
| 工作温度 | — | 0C to +85C (commercial grade per 'C' suffix) |
| 湿敏等级（MSL） | — | 3 (168 Hours) |
| Packaging | — | Tray |
| Lead-Free / Halogen-Free | — | Yes (LN suffix) |