EP3SE260F1517I3 vs EP3SE260F1517I3G 对比
详细并排对比 EP3SE260F1517I3 出自 Intel 和 EP3SE260F1517I3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260F1517I3 | EP3SE260F1517I3G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价(USD) | $10,500.00 | $3,520.00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Maximum User I/Os | 976 | — |
| 封装 | 1517-BBGA, FCBGA | 1517-ball FC-FBGA (Flip-Chip BGA) |
| 安装类型 | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | Industrial (-40C to +100C) |
| Junction Temperature Range | -40C to +125C | — |
| Core Voltage | 1.0 V typical | 1.1 V |
| Process Technology | 65 nm CMOS | — |
| Maximum Core Frequency | 717 MHz | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| RoHS 状态 | Compliant | — |
| Configuration | SRAM-based, volatile (requires external configuration device) | — |
| Embedded Memory Bits | — | 16,672,768 |
| Maximum Operating Frequency | — | 500 MHz |
| User I/O Count | — | 976 |
| Process Node | — | 65 nm |
| Embedded Multipliers | — | 768 (18x18) |
| PLL Count | — | 12 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Lead-Free / RoHS | — | Yes (RoHS compliant per DigiKey listing) |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |