EP3SE260H780C2N vs EP3SE260H780C4LN 对比
详细并排对比 EP3SE260H780C2N 出自 Intel 和 EP3SE260H780C4LN 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260H780C2N | EP3SE260H780C4LN |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3,600.00 | $11,950.00 |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 488 | 488 |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | — |
| 封装 | 780-BGA FCBGA | 780-ball FCBGA (FineLine BGA) |
| 安装类型 | Surface Mount | — |
| 工作温度范围 | Commercial (0C to +85C) | — |
| Speed Grade | C2 | C4 (commercial, moderate speed) |
| MSL 等级 | 3 (168 hours) | 3 (168 hours) |
| Reflow Peak Time Max | 40 s | — |
| RoHS 状态 | [DATA_NEEDED: rohs status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | 40 nm TSMC |
| Family | — | Stratix III E |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Logic Array Blocks (LABs) | — | 10,200 |
| Embedded Multipliers (18x18) | — | 384 |
| 工作温度 | — | 0C to +85C (commercial) |
| Core Voltage (VCC) | — | 1.0 V |
| I/O Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Auxiliary Voltage (VCCPD/VCCPT) | — | 2.5 V / 3.0 V |
| PLLs | — | 8 |
| Global Clock Networks | — | 16 |
| Configuration Modes | — | FPP, AS, PS, JTAG |