EP3SE50F484I3N vs EP3SL50F484I3N 对比

详细并排对比 EP3SE50F484I3N 出自 Intel 和 EP3SL50F484I3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SL50F484I3N EP3SL50F484I3N - 47.5K LE Stratix III L FPGA 484-FBGA | Intel

EP3SL50F484I3N - 47.5K LE Stratix III L FPGA 484-FBGA | Intel

EP3SL50F484I3N ⚠ 最后一次采购

规格对比

参数 EP3SE50F484I3N EP3SL50F484I3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 最后采购期
库存状态 有库存 有库存
单价(USD) $841.66 $552.30
Family Stratix III E Stratix III L
Logic Elements 47,500 47,500
Number of LABs 1,900 —
Total Memory Bits 5,760,000 —
Maximum User I/O 296 296
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Core Voltage VCC 0.9 V —
Auxiliary Voltage VCCAUX 1.1 V —
Process Technology 65 nm 65 nm CMOS
Maximum Internal Frequency 500 MHz —
Speed Grade I3 (industrial, bin 3) —
工作温度 -40C to +100C (industrial) —
封装 484-pin FC-FBGA (flip-chip BGA) 484-ball FBGA (FC-FBGA, 23x23 mm, 1.0 mm pitch)
安装类型 Surface Mount (BGA) Surface Mount (SMT)
Lead-Free / RoHS Yes (N suffix) Lead Free / Compliant
Configuration Method Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
Embedded Multipliers (18x18) [DATA_NEEDED: number of 18x18 multipliers] —
Transceiver Count [DATA_NEEDED: number of embedded transceivers] —
Logic Array Blocks (LABs) — 1,900
Embedded Memory — 2,184,192 bits (2.1 Mbit)
Embedded 18x18 Multipliers — 218
Core Voltage — 0.9 V / 1.1 V
Maximum Core Frequency — 500 MHz
工作结温 — -40C to +100C (Industrial)
MSL 等级 — [DATA_NEEDED: MSL level per JEDEC J-STD-020]
Programming Tool — Quartus II (legacy)

数据手册与资源

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